Green and Facile Synthesis of Hybrid Composites with Ultralow Dielectric Properties from Water-Soluble Polyimide and Dual-Porous Silica Nanoparticles

Kim, SunkyuLee, YeongjePark, JongminSo, YujinJung, Hee-TaeKo, Min JaeWon, Jong ChanJeong, SunhoKim, Yun Ho
Issue Date
American Chemical Society
ACS Applied Materials & Interfaces, v.15, no.3, pp.4408 - 4418
Here, we proposed an eco-friendly synthetic method for synthesizing hybrid composites with ultralow dielectric properties at high frequencies up to 28 GHz for true 5G communication from aqueous aromatic polyimide (PI) polymers and dual-porous silica nanoparticles (DPS). The "one-step" water-based emulsion template method was used to synthesize the macroporous silica nanoparticles (MPS). A substantially negative zeta potential was produced along the surface of MPS by the poly(vinylpyrrolidone)-based chemical functionalization, enabling excellent aqueous dispersion stability. The water-soluble poly(amic acid) (PAA), as a precursor to PI, was also "one-step" polymerized in an aqueous solution. The MPS were dispersed in a water-soluble PAA matrix to create the hybrid composite films using an entirely water-based approach. The compatibility between the PAA matrix and MPS was elucidated by investigating relatively diverse end-terminated PAAs (with either amine or carboxyl group). It was also discovered that, during a thermally activated imidization reaction, the MPS are in situ converted into the DPS with macro-and microporous structures (with a surface area of 1522.4 m2/g). The thermal, dielectric, mechanical, and morphological characteristics of each composite film were examined, while the amount of DPS in the PI matrix varied from 1 to 20 wt %. With the addition of 5 wt % DPS as an optimum condition, it showed ultralow dielectric properties, with the Dk and Df being 1.615 and 0.003 at a frequency of 28 GHz, respectively, and compatible mechanical properties, with the tensile strength and elastic modulus being 78.2 MPa and 0.32 GPa, respectively. These results can comprehensively satisfy various physical properties required as a substrate material for 5G communication devices.
FILMS; CONSTANT; polyimide; dual-porous; silica; composite; low dielectric
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