Construction of high-temperature electronic conduction paths for the scale-up of solid oxide fuel cell technology
- Authors
- Park, Mi Young; 박선영; Seo, Haewon; Jung, Jin-Mook; Hwang, Hyo Ki; Hong, Jongsup; Park, Jun-Young; Lee, Insung; Yoon, Kyung Joong
- Issue Date
- 2022-06
- Publisher
- Royal Society of Chemistry
- Citation
- Journal of Materials Chemistry A, v.10, no.22, pp.11917 - 11925
- Abstract
- Solid oxide fuel cells (SOFCs) currently face great opportunities in various applications. One of the critical issues for their commercialization involves cathode current collection in full-scale stacks because forming a reliable electronic conduction path in high-temperature oxidizing environments is extremely difficult. Herein, we present a Cu-Mn foam as a highly efficient, reliable, and cost-competitive cathode current collector. The Cu-Mn foam exists as a metallic alloy in the as-fabricated state, which offers adequate mechanical properties for stack assembly. Subsequently, it transforms into a conductive spinel oxide during high-temperature operation, providing the desired electrical and structural characteristics. Resistance measurements at 700 degrees C verify that the Cu-Mn foam was stable for 27 000 h. In unit cell testing, the foam performs comparably to a noble metal (Pt) mesh, and when the cell is enlarged from 4 to 100 cm(2), no performance loss occurs. Furthermore, it is successfully incorporated into a 1 kW-class full-size stack, where it demonstrates excellent durability in accelerated tests involving thermal and current cycling for 3684 h. This developed Cu-Mn foam can overcome a crucial limitation in the scale-up of SOFC technology and can also be utilized to construct high-temperature electronic conduction paths in various applications.
- Keywords
- CATHODE CONTACT MATERIALS; COPPER MANGANESE ALLOYS; INTERMEDIATE-TEMPERATURE; COMPOSITE CATHODE; PERFORMANCE EVALUATION; FE-22CR MESH; METAL FOAM; INTERCONNECT; OXIDATION; SPINELS
- ISSN
- 2050-7488
- URI
- https://pubs.kist.re.kr/handle/201004/115154
- DOI
- 10.1039/d2ta02468c
- Appears in Collections:
- KIST Article > 2022
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