Construction of high-temperature electronic conduction paths for the scale-up of solid oxide fuel cell technology

Authors
Park, Mi Young박선영Seo, HaewonJung, Jin-MookHwang, Hyo KiHong, JongsupPark, Jun-YoungLee, InsungYoon, Kyung Joong
Issue Date
2022-06
Publisher
Royal Society of Chemistry
Citation
Journal of Materials Chemistry A, v.10, no.22, pp.11917 - 11925
Abstract
Solid oxide fuel cells (SOFCs) currently face great opportunities in various applications. One of the critical issues for their commercialization involves cathode current collection in full-scale stacks because forming a reliable electronic conduction path in high-temperature oxidizing environments is extremely difficult. Herein, we present a Cu-Mn foam as a highly efficient, reliable, and cost-competitive cathode current collector. The Cu-Mn foam exists as a metallic alloy in the as-fabricated state, which offers adequate mechanical properties for stack assembly. Subsequently, it transforms into a conductive spinel oxide during high-temperature operation, providing the desired electrical and structural characteristics. Resistance measurements at 700 degrees C verify that the Cu-Mn foam was stable for 27 000 h. In unit cell testing, the foam performs comparably to a noble metal (Pt) mesh, and when the cell is enlarged from 4 to 100 cm(2), no performance loss occurs. Furthermore, it is successfully incorporated into a 1 kW-class full-size stack, where it demonstrates excellent durability in accelerated tests involving thermal and current cycling for 3684 h. This developed Cu-Mn foam can overcome a crucial limitation in the scale-up of SOFC technology and can also be utilized to construct high-temperature electronic conduction paths in various applications.
Keywords
CATHODE CONTACT MATERIALS; COPPER MANGANESE ALLOYS; INTERMEDIATE-TEMPERATURE; COMPOSITE CATHODE; PERFORMANCE EVALUATION; FE-22CR MESH; METAL FOAM; INTERCONNECT; OXIDATION; SPINELS
ISSN
2050-7488
URI
https://pubs.kist.re.kr/handle/201004/115154
DOI
10.1039/d2ta02468c
Appears in Collections:
KIST Article > 2022
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