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Octopus-Inspired Smart Adhesive Pads for Transfer Printing of Semiconducting Nanomembranes

Authors
Lee, Hochan; Um, Doo-Seung; Lee, Youngsu; Lim, Seongdong; Kim, Hyung-jun; Ko, Hyunhyub
Issue Date
2016-09-14
Publisher
WILEY-V C H VERLAG GMBH
Citation
ADVANCED MATERIALS, v.28, no.34, pp.7457 - 7465
Abstract
By mimicking muscle actuation to control cavity-pressure-induced adhesion of octopus suckers, smart adhesive pads are developed in which the thermo-responsive actuation of a hydrogel layer on elastomeric microcavity pads enables excellent switchable adhesion in response to a thermal stimulus (maximum adhesive strength: 94 kPa, adhesion switching ratio: approximate to 293 for temperature change between 22 and 61 degrees C).
Keywords
FIELD-EFFECT TRANSISTORS; REVERSIBLE ADHESION; FIBRILLAR ADHESIVE; THERMORESPONSIVE HYDROGELS; SWITCHABLE ADHESION; WET ADHESION; DRY ADHESIVE; TREE FROGS; GECKO; ELECTRONICS; FIELD-EFFECT TRANSISTORS; REVERSIBLE ADHESION; FIBRILLAR ADHESIVE; THERMORESPONSIVE HYDROGELS; SWITCHABLE ADHESION; WET ADHESION; DRY ADHESIVE; TREE FROGS; GECKO; ELECTRONICS; III-V semiconductor transistors; bioinspired; smart adhesives; thermoresponsive; transfer printing
ISSN
0935-9648
URI
https://pubs.kist.re.kr/handle/201004/123675
DOI
10.1002/adma.201601407
Appears in Collections:
KIST Article > 2016
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