Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Jae-Uk | - |
dc.contributor.author | Lee, Deuk-Hee | - |
dc.contributor.author | Kwon, Beomjin | - |
dc.contributor.author | Hyun, Dow-Bin | - |
dc.contributor.author | Nahm, Sahn | - |
dc.contributor.author | Baek, Seung-Hyub | - |
dc.contributor.author | Kim, Jin-Sang | - |
dc.date.accessioned | 2024-01-20T07:01:40Z | - |
dc.date.available | 2024-01-20T07:01:40Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 2015-06 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/125385 | - |
dc.description.abstract | In the present work, 0.01-0.05wt.% Sn-doped Bi-2(Te0.9Se0.1)(3) alloys were prepared by mechanical deformation followed by hot pressing, and their thermoelectric properties were studied. We observed that the Sn element is a very effective dopant as an acceptor to control the carrier concentration in the n-type Bi-2(Te0.9Se0.1)(3) alloys to optimize their thermoelectric property. The n-type carrier concentration can be controlled from 4.2 x 10(19)/cm(3) to 2.4 x 10(19)/cm(3) by 0.05wt.% Sn-doping. While the Seebeck coefficient and the electrical resistivity are both increased with doping, the power factor remains the same. Therefore, we found that the thermoelectric figure-of-merit becomes maximized at 0.75 when the thermal conductivity has a minimum value for the 0.03wt.% Sn-doped sample. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | PERFORMANCE | - |
dc.subject | TELLURIDE | - |
dc.subject | CRYSTALS | - |
dc.subject | HEAT | - |
dc.title | Effect of Sn Doping on the Thermoelectric Properties of n-type Bi-2(Te,Se)(3) Alloys | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s11664-014-3598-z | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | JOURNAL OF ELECTRONIC MATERIALS, v.44, no.6, pp.1926 - 1930 | - |
dc.citation.title | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.citation.volume | 44 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 1926 | - |
dc.citation.endPage | 1930 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000353813700080 | - |
dc.identifier.scopusid | 2-s2.0-84939962781 | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordPlus | TELLURIDE | - |
dc.subject.keywordPlus | CRYSTALS | - |
dc.subject.keywordPlus | HEAT | - |
dc.subject.keywordAuthor | Bismuth telluride | - |
dc.subject.keywordAuthor | thermoelectric | - |
dc.subject.keywordAuthor | Sn doping | - |
dc.subject.keywordAuthor | mechanical deformation | - |
dc.subject.keywordAuthor | hot press | - |
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