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dc.contributor.authorKim, Sang-Hyeon-
dc.contributor.authorYokoyama, Masafumi-
dc.contributor.authorNakane, Ryosho-
dc.contributor.authorIchikawa, Osamu-
dc.contributor.authorOsada, Takenori-
dc.contributor.authorHata, Masahiko-
dc.contributor.authorTakenaka, Mitsuru-
dc.contributor.authorTakagi, Shinichi-
dc.date.accessioned2024-01-20T10:01:28Z-
dc.date.available2024-01-20T10:01:28Z-
dc.date.created2021-08-31-
dc.date.issued2014-05-
dc.identifier.issn0018-9383-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/126864-
dc.description.abstractWe have investigated the effects of the tri-gate channel structure on electrical properties of extremely thin-body (ETB) InAs-on-insulator (-OI) MOSFETs. It was found that the tri-gate structure provides significant improvement in short channel effect (SCE) control even in ETB-OI MOSFETs by the simulation. We have fabricated and demonstrated tri-gate InAsOI MOSFETs with fin width of the top surface down to 40 nm. The tri-gate ETB InAs-OI MOSFETs shows better SCEs control with small effective mobility (mu(eff)) reduction. Thus, we have demonstrated the operation of sub-20-nm-channel length (L-ch) InAs-OI MOSFETs. The 20-nm-L-ch InAs-OI MOSFETs show good electrostatic with subthreshold slope of 120 mV/decade and drain induced barrier lowering of 110 mV/V, and high transconductance (G(m)) of 1.64 mS/mu m. Furthermore, we have realized a wide-range threshold voltage (V-th) tunability in tri-gate InAs-OI MOSFETs through back bias voltage (V-B) control.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectFIELD-EFFECT TRANSISTORS-
dc.subjectELECTRON-
dc.subjectMOBILITY-
dc.subjectS/D-
dc.subjectSI-
dc.titleHigh Performance Tri-Gate Extremely Thin-Body InAs-On-Insulator MOSFETs With High Short Channel Effect Immunity and V-th Tunability-
dc.typeArticle-
dc.identifier.doi10.1109/TED.2014.2312546-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON ELECTRON DEVICES, v.61, no.5, pp.1354 - 1360-
dc.citation.titleIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.citation.volume61-
dc.citation.number5-
dc.citation.startPage1354-
dc.citation.endPage1360-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000337753300020-
dc.identifier.scopusid2-s2.0-84899924195-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle-
dc.subject.keywordPlusFIELD-EFFECT TRANSISTORS-
dc.subject.keywordPlusELECTRON-
dc.subject.keywordPlusMOBILITY-
dc.subject.keywordPlusS/D-
dc.subject.keywordPlusSI-
dc.subject.keywordAuthorBody factor-
dc.subject.keywordAuthorextremely thin-body (ETB) MOSFETs-
dc.subject.keywordAuthorInGaAs MOSFETs-
dc.subject.keywordAuthormetal source and drain (S/D)-
dc.subject.keywordAuthorNi-InGaAs S/D-
dc.subject.keywordAuthortri-gate-
dc.subject.keywordAuthorV-th tenability-
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