Full metadata record

DC Field Value Language
dc.contributor.authorOh, Hyun Gon-
dc.contributor.authorJeong, Cherlhyun-
dc.contributor.authorCho, Il Hwan-
dc.date.accessioned2024-01-20T10:32:03Z-
dc.date.available2024-01-20T10:32:03Z-
dc.date.created2021-09-05-
dc.date.issued2014-02-
dc.identifier.issn0021-4922-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/127138-
dc.description.abstractThe self-heating effects (SHEs) of saddle metal oxide semiconductor field-effect transistors (MOSFETs) and gate dimensional impacts on thermal characteristics have been investigated on the basis of a realistic thermal conductivity of silicon and other materials. Thermal characteristics were analyzed by thermal resistance of Si channel. Since Si material has larger thermal conductivity than that of silicon dioxide, it is shown that the length of the side gate of saddle MOSFETs determines heat dissipation of Si channel. Side gate of saddle MOSFETs can be one of the important parameter in device optimization. (C) 2014 The Japan Society of Applied Physics-
dc.languageEnglish-
dc.publisherIOP PUBLISHING LTD-
dc.titleThermal analysis of self-heating in saddle MOSFET devices-
dc.typeArticle-
dc.identifier.doi10.7567/JJAP.53.020303-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJAPANESE JOURNAL OF APPLIED PHYSICS, v.53, no.2-
dc.citation.titleJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.citation.volume53-
dc.citation.number2-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000332593200003-
dc.identifier.scopusid2-s2.0-84893231773-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle-
dc.subject.keywordAuthorMOSFET-
dc.subject.keywordAuthorself-heating effects-
dc.subject.keywordAuthorSimulation-
dc.subject.keywordAuthorsaddle structure-
Appears in Collections:
KIST Article > 2014
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE