Full metadata record

DC Field Value Language
dc.contributor.authorPovstugar, Ivan-
dc.contributor.authorChoi, Pyuck-Pa-
dc.contributor.authorTytko, Darius-
dc.contributor.authorAhn, Jae-Pyeong-
dc.contributor.authorRaabe, Dierk-
dc.date.accessioned2024-01-20T11:01:30Z-
dc.date.available2024-01-20T11:01:30Z-
dc.date.created2022-01-25-
dc.date.issued2013-12-
dc.identifier.issn1359-6454-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/127353-
dc.description.abstractMicrostructural and compositional changes in TiAlN/CrN multilayered films occurring at temperatures up to 1000 degrees C were studied at different length scales by a combination of atom probe tomography, transmission electron microscopy and X-ray diffraction. We observe the onset of decomposition of the multilayer structure at 700 degrees C via the mechanism of interface-directed spinodal decomposition of TiAlN layers, where Al atoms preferentially move toward the nearest interface and segregate there. The interface-directed mechanism later transforms into isotropic spinodal decomposition and is accompanied by intense interdiffusion between the constituting layers. Distinct compositional gradients across columnar grain boundaries (extending perpendicular to the multilayers) are detected at this stage of decomposition. Drastic differences in decomposition behavior across the film depth were observed at elevated temperatures (800-1000 degrees C): the layered structure completely dissolves in the near-surface part but persists in the regions distant from the surface. The influence of residual stresses caused by the sputter deposition process on the thermally induced evolution of the multilayer thin films is discussed. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.titleInterface-directed spinodal decomposition in TiAlN/CrN multilayer hard coatings studied by atom probe tomography-
dc.typeArticle-
dc.identifier.doi10.1016/j.actamat.2013.08.028-
dc.description.journalClass1-
dc.identifier.bibliographicCitationACTA MATERIALIA, v.61, no.20, pp.7534 - 7542-
dc.citation.titleACTA MATERIALIA-
dc.citation.volume61-
dc.citation.number20-
dc.citation.startPage7534-
dc.citation.endPage7542-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000328179700002-
dc.identifier.scopusid2-s2.0-84886299681-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusTHERMAL-STABILITY-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusSUPERLATTICE COATINGS-
dc.subject.keywordPlusSUPERHARD COATINGS-
dc.subject.keywordPlusN SYSTEM-
dc.subject.keywordPlusSTRESS-
dc.subject.keywordPlusOXIDATION-
dc.subject.keywordPlusLAYER-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordAuthorMultilayer thin films-
dc.subject.keywordAuthorNitrides-
dc.subject.keywordAuthorAtom probe tomography (APT)-
dc.subject.keywordAuthorSpinodal decomposition-
dc.subject.keywordAuthorResidual stresses-
Appears in Collections:
KIST Article > 2013
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE