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dc.contributor.authorBaral, Ashok Kumar-
dc.contributor.authorDasari, Hari Prasad-
dc.contributor.authorKim, Byung-Kook-
dc.contributor.authorLee, Jong-Ho-
dc.date.accessioned2024-01-20T11:05:01Z-
dc.date.available2024-01-20T11:05:01Z-
dc.date.created2021-09-05-
dc.date.issued2013-10-25-
dc.identifier.issn0925-8388-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/127532-
dc.description.abstractElectrical and dielectric properties of the nanocrystalline GDC materials co-doped with CoO (by deposition precipitation method) were studied in the temperature range of 150-600 degrees C. CoO co-doped samples show higher grain interior conductivity than that of GDC. Dielectric loss tangent (tan delta) shows the presence of defect associates such as (Co - V-<(o)double over dot> - Co) and (Co - V-<(o)double over dot>) in co-doped samples in addition to the defects (Gd - V-<(o)double over dot> - Gd) and (Gd - V-<(o)double over dot>) that are present in GDC system. Dynamic parameters such as migration energy and association energy of oxygen vacancies do not vary significantly with co-doping CoO in the GDC materials. With higher content of CoO, excess of Co2+ in the grain boundary regions leads to trapping of vacancies and/or depletion of vacancies in the space charge region. Therefore grain boundary activation energy increases and grain boundary conductivity decreases with CoO content above 1 mol%, at lower temperatures. In the temperature range of 150-600 degrees C overall conductivities in CoO co-doped samples increase two to three times than that of GDC material. (C) 2013 Elsevier B. V. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectELECTRICAL-CONDUCTIVITY-
dc.subjectSINTERABILITY-
dc.subjectRELAXATION-
dc.subjectSM-
dc.titleEffect of sintering aid (CoO) on transport properties of nanocrystalline Gd doped ceria (GDC) materials prepared by co-precipitation method-
dc.typeArticle-
dc.identifier.doi10.1016/j.jallcom.2013.05.191-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJOURNAL OF ALLOYS AND COMPOUNDS, v.575, pp.455 - 460-
dc.citation.titleJOURNAL OF ALLOYS AND COMPOUNDS-
dc.citation.volume575-
dc.citation.startPage455-
dc.citation.endPage460-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000321751000070-
dc.identifier.scopusid2-s2.0-84880184560-
dc.relation.journalWebOfScienceCategoryChemistry, Physical-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusELECTRICAL-CONDUCTIVITY-
dc.subject.keywordPlusSINTERABILITY-
dc.subject.keywordPlusRELAXATION-
dc.subject.keywordPlusSM-
dc.subject.keywordAuthorIonic conductivity-
dc.subject.keywordAuthorDielectric loss tangent-
dc.subject.keywordAuthorDefect pairs-
dc.subject.keywordAuthorAssociation energy-
dc.subject.keywordAuthorMigration energy-
dc.subject.keywordAuthorGrain boundary conductivity-
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