Porous Polyimide Membranes Prepared by Wet Phase Inversion for Use in Low Dielectric Applications
- Authors
- Kim, Soohyun; Jang, Keon-Soo; Choi, Hee-Dok; Choi, Seung-Hoon; Kwon, Seong-Ji; Kim, Il-Doo; Lim, Jung Ah; Hong, Jae-Min
- Issue Date
- 2013-05
- Publisher
- MDPI AG
- Citation
- INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES, v.14, no.5, pp.8698 - 8707
- Abstract
- A wet phase inversion process of polyamic acid (PAA) allowed fabrication of a porous membrane of polyimide (PI) with the combination of a low dielectric constant (1.7) and reasonable mechanical properties (Tensile strain: 8.04%, toughness: 3.4 MJ/m(3), tensile stress: 39.17 MPa, and young modulus: 1.13 GPa), with further thermal imidization process of PAA. PAA was simply synthesized from purified pyromellitic dianhydride (PMDA) and 4,4-oxydianiline (ODA) in two different reaction solvents such as gamma-butyrolactone (GBL) and N-methyl-2-pyrrolidinone (NMP), which produce M-w/PDI of 630,000/1.45 and 280,000/2.0, respectively. The porous PAA membrane was fabricated by the wet phase inversion process based on a solvent/non-solvent system via tailored composition between GBL and NMP. The porosity of PI, indicative of a low electric constant, decreased with increasing concentration of GBL, which was caused by sponge-like formation. However, due to interplay between the low electric constant (structural formation) and the mechanical properties, GBL was employed for further exploration, using toluene and acetone vs. DI-water as a coagulation media. Non-solvents influenced determination of the PAA membrane size and porosity. With this approach, insight into the interplay between dielectric properties and mechanical properties will inform a wide range of potential low-k material applications.
- Keywords
- CONSTANT MATERIALS; FILMS; SOLVENT; CONSTANT MATERIALS; FILMS; SOLVENT; low K material; porous polyimide; poly amic acid; wet phase inversion
- ISSN
- 1661-6596
- URI
- https://pubs.kist.re.kr/handle/201004/128107
- DOI
- 10.3390/ijms14058698
- Appears in Collections:
- KIST Article > 2013
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