Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Byoung-Joon | - |
dc.contributor.author | Cho, Yigil | - |
dc.contributor.author | Jung, Min-Suk | - |
dc.contributor.author | Shin, Hae-A-Seul | - |
dc.contributor.author | Moon, Myoung-Woon | - |
dc.contributor.author | Han, Heung Nam | - |
dc.contributor.author | Nam, Ki Tae | - |
dc.contributor.author | Joo, Young-Chang | - |
dc.contributor.author | Choi, In-Suk | - |
dc.date.accessioned | 2024-01-20T13:32:56Z | - |
dc.date.available | 2024-01-20T13:32:56Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 2012-11-05 | - |
dc.identifier.issn | 1613-6810 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/128660 | - |
dc.description.abstract | Design and fabrication of reliable electrodes is one of the most important challenges in flexible devices, which undergo repeated deformation. In conventional approaches, mechanical and electrical properties of continuous metal films degrade gradually because of the fatigue damage. The designed incorporation of nanoholes into Cu electrodes can enhance the reliability. In this study, the electrode shows extremely low electrical resistance change during bending fatigue because the nanoholes suppress crack initiation by preventing protrusion formation and damage propagation by crack tip blunting. This concept provides a key guideline for developing fatigue-free flexible electrodes. | - |
dc.language | English | - |
dc.publisher | WILEY-V C H VERLAG GMBH | - |
dc.subject | FILMS | - |
dc.subject | DEFORMATION | - |
dc.subject | MICROMECHANICS | - |
dc.subject | TRANSPARENT | - |
dc.subject | NANOWIRES | - |
dc.subject | PAPER | - |
dc.title | Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/smll.201200674 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | SMALL, v.8, no.21, pp.3300 - 3306 | - |
dc.citation.title | SMALL | - |
dc.citation.volume | 8 | - |
dc.citation.number | 21 | - |
dc.citation.startPage | 3300 | - |
dc.citation.endPage | 3306 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000310600600009 | - |
dc.identifier.scopusid | 2-s2.0-84868368667 | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | DEFORMATION | - |
dc.subject.keywordPlus | MICROMECHANICS | - |
dc.subject.keywordPlus | TRANSPARENT | - |
dc.subject.keywordPlus | NANOWIRES | - |
dc.subject.keywordPlus | PAPER | - |
dc.subject.keywordAuthor | bending | - |
dc.subject.keywordAuthor | conductivity | - |
dc.subject.keywordAuthor | copper | - |
dc.subject.keywordAuthor | electrodes | - |
dc.subject.keywordAuthor | nanostructures | - |
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