Characteristics of lead-free transparent dielectrics contaminated with moisture

Authors
Oh, Young-JeiJang, Byung-KoogKim, Hyun-OhLim, Dae-Soon
Issue Date
2011-09-15
Publisher
ELSEVIER SCIENCE SA
Citation
MATERIALS CHEMISTRY AND PHYSICS, v.129, no.1-2, pp.134 - 137
Abstract
A green sheet of lead-free transparent dielectrics for the upper panel in a plasma display panel (PDP) was prepared by the tape-casting method. The dispersion characteristics of dielectric frit powder contaminated with moisture of 0-0.1 wt% were investigated to evaluate the properties of the fired transparent dielectric films. The dispersion stability was not severely affected by moisture up to 0.1 wt% on the frit powder, but agglomerations, together with precipitation of the powders, occurred under all conditions of moisture contamination. Moisture affects the pore size and distribution of the fired transparent dielectric thin films, which reduces the strength of the green sheet and withstanding voltage of the films fired. (C) 2011 Elsevier BM. All rights reserved.
Keywords
TAPE-CASTING TECHNOLOGY; SLIP ADDITIVES; SOLVENTS; TAPE-CASTING TECHNOLOGY; SLIP ADDITIVES; SOLVENTS; Plasma display panel (POP); Green sheet; Transparent dielectric; Moisture contamination
ISSN
0254-0584
URI
https://pubs.kist.re.kr/handle/201004/129984
DOI
10.1016/j.matchemphys.2011.03.075
Appears in Collections:
KIST Article > 2011
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