Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hwa Young | - |
dc.date.accessioned | 2024-01-20T19:00:33Z | - |
dc.date.available | 2024-01-20T19:00:33Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 2010-08 | - |
dc.identifier.issn | 1380-2224 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/131217 | - |
dc.description.abstract | The effect of concentration of Cu(II) on the throwing power has been studied in the electrodeposition of Cu on the porous reticular cathode with electrolytes of CuSO4 and H2SO4. Hull cell tests as well as the electrodeposition on the porous reticular cathode have been carried out to illustrate the variation of throwing power with concentration of Cu(II). It was observed that the cathodic polarizability was increased with decrease in concentration of Cu(II). In the Hull cell tests, the morphology and the thickness of Cu layer were influenced remarkably by concentration of Cu(II). It was also found that both the throwing power and the limiting current density should be taken into account so as to obtain the uniform and regular deposits of Cu in the electrodeposition on the porous reticular cathode. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | ASPECT-RATIO TRENCHES | - |
dc.subject | HEAT-TRANSFER | - |
dc.subject | METAL | - |
dc.subject | COPPER | - |
dc.subject | MEMBRANE | - |
dc.subject | SUPPORT | - |
dc.subject | VIAS | - |
dc.title | Effect of concentration of Cu(II) on throwing power in electrodeposition on porous reticular cathode | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s10934-009-9304-5 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | JOURNAL OF POROUS MATERIALS, v.17, no.4, pp.429 - 434 | - |
dc.citation.title | JOURNAL OF POROUS MATERIALS | - |
dc.citation.volume | 17 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 429 | - |
dc.citation.endPage | 434 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000279309500006 | - |
dc.identifier.scopusid | 2-s2.0-77957363114 | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Applied | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | ASPECT-RATIO TRENCHES | - |
dc.subject.keywordPlus | HEAT-TRANSFER | - |
dc.subject.keywordPlus | METAL | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | MEMBRANE | - |
dc.subject.keywordPlus | SUPPORT | - |
dc.subject.keywordPlus | VIAS | - |
dc.subject.keywordAuthor | Electrodeposition | - |
dc.subject.keywordAuthor | Copper | - |
dc.subject.keywordAuthor | Metal foam | - |
dc.subject.keywordAuthor | Throwing power | - |
dc.subject.keywordAuthor | Porous cathode | - |
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