MOCVD를 이용한 BiSbTe3 박막성장 및 열전소자 제작

Other Titles
Properties of BiSbTe3 Thin Film Prepared by MOCVD and Fabrication of Thermoelectric Devices
Authors
고려대학교윤석진주병권김진상
Issue Date
2009-05
Publisher
한국전기전자재료학회
Citation
전기전자재료학회논문지, v.22, no.5, pp.443 - 447
Abstract
Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type Bi0.4Sb1.6Te3 and n-type Bi2Te3 thin films. Firstly, the p-type thermoelectric element was patterned after growth of 5 ㎛ thickness of Bi0.4Sb1.6Te3 layer. Again n-type Bi2Te3 film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for Bi2Te3. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3 ㎛ is obtained at the temperature difference of 45 K.
Keywords
Thin film; Thermoelectric; MOCVD; Bismuth-antimony-telluride; Thin film; Thermoelectric; MOCVD; Bismuth-antimony-telluride
ISSN
1226-7945
URI
https://pubs.kist.re.kr/handle/201004/132506
Appears in Collections:
KIST Article > 2009
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