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dc.contributor.authorWei, Xiaoding-
dc.contributor.authorLee, Dongyun-
dc.contributor.authorShim, Sanghoon-
dc.contributor.authorChen, Xi-
dc.contributor.authorKysar, Jeffrey W.-
dc.date.accessioned2024-01-21T00:33:13Z-
dc.date.available2024-01-21T00:33:13Z-
dc.date.created2021-09-02-
dc.date.issued2007-09-
dc.identifier.issn1359-6462-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/134161-
dc.description.abstractFree-standing nanocrystalline Cu films with grain size around 39 mn are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10(-5) s(-1). No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectGRAIN-SIZE DEPENDENCE-
dc.subjectMECHANICAL-PROPERTIES-
dc.subjectPLASTIC-DEFORMATION-
dc.subjectTENSILE BEHAVIOR-
dc.subjectRATE SENSITIVITY-
dc.subjectMETALS-
dc.subjectGROWTH-
dc.subjectPALLADIUM-
dc.subjectSTRESS-
dc.subjectSTRENGTH-
dc.titlePlain-strain bulge test for nanocrystalline copper thin films-
dc.typeArticle-
dc.identifier.doi10.1016/j.scriptamat.2007.05.012-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSCRIPTA MATERIALIA, v.57, no.6, pp.541 - 544-
dc.citation.titleSCRIPTA MATERIALIA-
dc.citation.volume57-
dc.citation.number6-
dc.citation.startPage541-
dc.citation.endPage544-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000248638600024-
dc.identifier.scopusid2-s2.0-34447251637-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusGRAIN-SIZE DEPENDENCE-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusPLASTIC-DEFORMATION-
dc.subject.keywordPlusTENSILE BEHAVIOR-
dc.subject.keywordPlusRATE SENSITIVITY-
dc.subject.keywordPlusMETALS-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusPALLADIUM-
dc.subject.keywordPlusSTRESS-
dc.subject.keywordPlusSTRENGTH-
dc.subject.keywordAuthornanocrystalline materials-
dc.subject.keywordAuthorthin films-
dc.subject.keywordAuthorbulge test-
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