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dc.contributor.authorJung, K.-
dc.contributor.authorLee, J.-K.-
dc.contributor.authorIm, H.-
dc.contributor.authorKarpinski, L.-
dc.contributor.authorScholz, M.-
dc.contributor.authorLee, J.-K.-
dc.date.accessioned2024-01-21T01:01:42Z-
dc.date.available2024-01-21T01:01:42Z-
dc.date.created2021-09-02-
dc.date.issued2007-06-
dc.identifier.issn1225-0562-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/134354-
dc.description.abstractChromium oxide thin films have been deposited on silicon substrates using a tabletop 9kJ mather-typed plasma focus (PF) device. Before deposition, pinch behavior with gas pressure was observed. Strength of pinches was increased with increasing working pressure. Deposition was performed at room temperature as a function of working pressure between 50 and 1000 mTorr. Composition and surface morphology of the films were analyzed by Auger Electron Spectroscopy and Scanning Electron Microscope, respectively. Growth rates of the films were decreased with pressure. The oxide films were polycrystalline containing some impurities, Cu, Fe, C and revealed freer grain structure at lower pressure.-
dc.languageKorean-
dc.publisherMaterials Research Society of Korea-
dc.titleDependence of gas pressure on Cr Oxide thin film growth using a plasma focus device-
dc.typeArticle-
dc.identifier.doi10.3740/MRSK.2007.17.6.308-
dc.description.journalClass1-
dc.identifier.bibliographicCitationKorean Journal of Materials Research, v.17, no.6, pp.308 - 312-
dc.citation.titleKorean Journal of Materials Research-
dc.citation.volume17-
dc.citation.number6-
dc.citation.startPage308-
dc.citation.endPage312-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.identifier.kciidART001059700-
dc.identifier.scopusid2-s2.0-34548046046-
dc.type.docTypeArticle-
dc.subject.keywordAuthorCr oxide thin film-
dc.subject.keywordAuthorDeposition-
dc.subject.keywordAuthorIon emission-
dc.subject.keywordAuthorPlasma focus-
dc.subject.keywordAuthorWorking pressure-
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