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dc.contributor.authorKim, Han-Ki-
dc.contributor.authorKim, Myung Soo-
dc.contributor.authorPark, Jeong-Woo-
dc.contributor.authorCho, Woon Jo-
dc.date.accessioned2024-01-21T01:31:06Z-
dc.date.available2024-01-21T01:31:06Z-
dc.date.created2021-09-05-
dc.date.issued2007-03-
dc.identifier.issn0013-4651-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/134587-
dc.description.abstractThe effect of hydrogen dilution on the microstructure of in situ polycrystalline Si (poly-Si) films grown by catalyzer-enhanced chemical vapor deposition (CECVD) has been investigated using transmission electron microscopy and transmission electron diffraction analysis. It was shown that the microstructure of the Si films grown at a low substrate temperature (< 80 degrees C) in a CECVD was strongly affected by the hydrogen dilution ratio (H-2/SiH4). In addition, a secondary ion mass spectroscopy depth profile of the in situ poly-Si film grown by CECVD at SiH4/H-2 (10/400 sccm ) exhibited much lower hydrogen concentration than dehydrogenated amorphous Si film grown by conventional plasma-enhanced chemical deposition. These results indicate that the CECVD technique is a promising candidate to grow high-quality in situ poly-Si films on glass or a flexible substrate for low-temperature poly-Si and flexible displays. (c) 2007 The Electrochemical Society. All rights reserved.-
dc.languageEnglish-
dc.publisherELECTROCHEMICAL SOC INC-
dc.subjectSILICON THIN-FILMS-
dc.subjectAMORPHOUS-SILICON-
dc.subjectLOW-TEMPERATURE-
dc.subjectCRYSTALLIZATION-
dc.subjectDECOMPOSITION-
dc.subjectFILAMENT-
dc.subjectKINETICS-
dc.subjectPLASMA-
dc.subjectLAYER-
dc.titleTransmission electron microscope study of in situ polycrystalline Si film grown by catalyzer-enhanced chemical vapor deposition-
dc.typeArticle-
dc.identifier.doi10.1149/1.2422871-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.154, no.3, pp.J73 - J76-
dc.citation.titleJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.volume154-
dc.citation.number3-
dc.citation.startPageJ73-
dc.citation.endPageJ76-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000243977500082-
dc.identifier.scopusid2-s2.0-33847006636-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusSILICON THIN-FILMS-
dc.subject.keywordPlusAMORPHOUS-SILICON-
dc.subject.keywordPlusLOW-TEMPERATURE-
dc.subject.keywordPlusCRYSTALLIZATION-
dc.subject.keywordPlusDECOMPOSITION-
dc.subject.keywordPlusFILAMENT-
dc.subject.keywordPlusKINETICS-
dc.subject.keywordPlusPLASMA-
dc.subject.keywordPlusLAYER-
dc.subject.keywordAuthorsilicon-
dc.subject.keywordAuthorcvd-
dc.subject.keywordAuthorpolycrystalline-
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