Effect of indium on bonding between porcelain and Au-Pt-Cu alloy

Abstract

Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding. between In2O3 and various oxides in porcelain, and also to improving the anchoring effect.