연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성

Abstract

Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron-sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of θ and cycle time of λ, the characteristics and thickness of the deposited copper film are controlled. As θ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at θ = 0.33 and cycle time of 30min. The uniformity of copper film shows 5% in our experimental range.