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dc.contributor.authorKim, J-
dc.contributor.authorJun, HW-
dc.contributor.authorSong, H-
dc.contributor.authorLee, JH-
dc.contributor.authorLee, HW-
dc.date.accessioned2024-01-21T05:31:18Z-
dc.date.available2024-01-21T05:31:18Z-
dc.date.created2021-09-03-
dc.date.issued2005-03-
dc.identifier.issn1013-9826-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/136697-
dc.description.abstractHigh strength reaction-bonded silicon carbide ceramics was successfully produced by reducing the amount of residual silicon and the silicon pocket size with carbon black as an additional carbon source. A prototype of wafer carrier was also produced in near-net dimension by planar contact infiltration of molten silicon into a preform joined with six pieces of simple shape by eliminating process shrinkages. Forming shrinkages were decreased to a negligible level by compression molding, while sintering shrinkage was eliminated by reactive infiltration of molten silicon.-
dc.languageEnglish-
dc.publisherTRANS TECH PUBLICATIONS LTD-
dc.titleEffect of carbon black addition on reaction-bonded silicon carbide ceramics-
dc.typeArticle-
dc.identifier.doi10.4028/www.scientific.net/KEM.287.189-
dc.description.journalClass1-
dc.identifier.bibliographicCitationADVANCED SI-BASED CERAMICS AND COMPOSITES, v.287, pp.189 - 193-
dc.citation.titleADVANCED SI-BASED CERAMICS AND COMPOSITES-
dc.citation.volume287-
dc.citation.startPage189-
dc.citation.endPage193-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000228550000032-
dc.identifier.scopusid2-s2.0-34249673429-
dc.relation.journalWebOfScienceCategoryMaterials Science, Ceramics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Composites-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle; Proceedings Paper-
dc.subject.keywordAuthorcompression molding-
dc.subject.keywordAuthorRBSC-
dc.subject.keywordAuthorreactive infiltration-
dc.subject.keywordAuthorcarbon black-
dc.subject.keywordAuthorwafer carrier-
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KIST Article > 2005
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