Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, J | - |
dc.contributor.author | Jun, HW | - |
dc.contributor.author | Song, H | - |
dc.contributor.author | Lee, JH | - |
dc.contributor.author | Lee, HW | - |
dc.date.accessioned | 2024-01-21T05:31:18Z | - |
dc.date.available | 2024-01-21T05:31:18Z | - |
dc.date.created | 2021-09-03 | - |
dc.date.issued | 2005-03 | - |
dc.identifier.issn | 1013-9826 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/136697 | - |
dc.description.abstract | High strength reaction-bonded silicon carbide ceramics was successfully produced by reducing the amount of residual silicon and the silicon pocket size with carbon black as an additional carbon source. A prototype of wafer carrier was also produced in near-net dimension by planar contact infiltration of molten silicon into a preform joined with six pieces of simple shape by eliminating process shrinkages. Forming shrinkages were decreased to a negligible level by compression molding, while sintering shrinkage was eliminated by reactive infiltration of molten silicon. | - |
dc.language | English | - |
dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
dc.title | Effect of carbon black addition on reaction-bonded silicon carbide ceramics | - |
dc.type | Article | - |
dc.identifier.doi | 10.4028/www.scientific.net/KEM.287.189 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | ADVANCED SI-BASED CERAMICS AND COMPOSITES, v.287, pp.189 - 193 | - |
dc.citation.title | ADVANCED SI-BASED CERAMICS AND COMPOSITES | - |
dc.citation.volume | 287 | - |
dc.citation.startPage | 189 | - |
dc.citation.endPage | 193 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000228550000032 | - |
dc.identifier.scopusid | 2-s2.0-34249673429 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Composites | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | compression molding | - |
dc.subject.keywordAuthor | RBSC | - |
dc.subject.keywordAuthor | reactive infiltration | - |
dc.subject.keywordAuthor | carbon black | - |
dc.subject.keywordAuthor | wafer carrier | - |
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