Microstructure and adhesion of Au deposited on parylene-c substrate with surface modification for potential immunoassay application

Authors
Lee, JHHwang, KSYoon, KHKim, TSAhn, S
Issue Date
2004-04
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON PLASMA SCIENCE, v.32, no.2, pp.505 - 509
Abstract
Improvement of recrystallization and adhesion of gold (Au) deposited on parylene-c (Pa-c) substrate with heat treatment and surface modification using physical and chemical treatment was investigated. Annealing of An on Pa-c was performed to observe microstructure enhancement due to heat treatment from 100 to 250 degreesC. From the peak intensity and full-width at half-maximum of Au(111), its crystallinity appeared to improve as the annealing temperature increased, which can provide the surface with proper creation of monolayers. Several physical and chemical methods of surface modifications were employed to analyze surface energy and adhesion promotion, such as oxygen plasma, atmospheric plasma, ion beam, and Bovine serum albumin. These results exhibit excellent adhesion properties by exploiting oxygen plasma and ion-beam treatment, which induce carbonyl groups via the mechanical interlocking.
Keywords
ENERGY; FILMS; STABILITY; COPPER; ENERGY; FILMS; STABILITY; COPPER; adhesion; carbonyl groups; gold (Au); parylene; surface modification; surface roughness
ISSN
0093-3813
URI
https://pubs.kist.re.kr/handle/201004/137720
DOI
10.1109/TPS.2004.831185
Appears in Collections:
KIST Article > 2004
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