Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, TW | - |
dc.contributor.author | Chang, HS | - |
dc.contributor.author | Park, SW | - |
dc.date.accessioned | 2024-01-21T12:32:33Z | - |
dc.date.available | 2024-01-21T12:32:33Z | - |
dc.date.created | 2021-09-04 | - |
dc.date.issued | 2001-05 | - |
dc.identifier.issn | 0261-8028 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/140519 | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | SILICON-NITRIDE | - |
dc.title | Re-distribution of thermal residual stress in a brazed Si3N4/stainless steel joint using laminated interlayers | - |
dc.type | Article | - |
dc.identifier.doi | 10.1023/A:1010965808405 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS SCIENCE LETTERS, v.20, no.10, pp.973 - 976 | - |
dc.citation.title | JOURNAL OF MATERIALS SCIENCE LETTERS | - |
dc.citation.volume | 20 | - |
dc.citation.number | 10 | - |
dc.citation.startPage | 973 | - |
dc.citation.endPage | 976 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000169504000026 | - |
dc.identifier.scopusid | 2-s2.0-0035872505 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | SILICON-NITRIDE | - |
dc.subject.keywordAuthor | brazing | - |
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