Full metadata record

DC Field Value Language
dc.contributor.authorKim, TW-
dc.contributor.authorChang, HS-
dc.contributor.authorPark, SW-
dc.date.accessioned2024-01-21T12:32:33Z-
dc.date.available2024-01-21T12:32:33Z-
dc.date.created2021-09-04-
dc.date.issued2001-05-
dc.identifier.issn0261-8028-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/140519-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.subjectSILICON-NITRIDE-
dc.titleRe-distribution of thermal residual stress in a brazed Si3N4/stainless steel joint using laminated interlayers-
dc.typeArticle-
dc.identifier.doi10.1023/A:1010965808405-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJOURNAL OF MATERIALS SCIENCE LETTERS, v.20, no.10, pp.973 - 976-
dc.citation.titleJOURNAL OF MATERIALS SCIENCE LETTERS-
dc.citation.volume20-
dc.citation.number10-
dc.citation.startPage973-
dc.citation.endPage976-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000169504000026-
dc.identifier.scopusid2-s2.0-0035872505-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusSILICON-NITRIDE-
dc.subject.keywordAuthorbrazing-
Appears in Collections:
KIST Article > 2001
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE