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dc.contributor.author주병권-
dc.contributor.author이덕중-
dc.date.accessioned2024-01-21T14:39:52Z-
dc.date.available2024-01-21T14:39:52Z-
dc.date.created2022-01-10-
dc.date.issued1999-12-
dc.identifier.issn1226-7945-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/141744-
dc.publisher한국전기전자재료학회-
dc.titleTechnical improvement of FED tubeless packaging-
dc.title.alternativeFED tubeless packaging의 기술적 개선-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation전기전자재료학회논문지, v.12, no.12, pp.1097 - 1101-
dc.citation.title전기전자재료학회논문지-
dc.citation.volume12-
dc.citation.number12-
dc.citation.startPage1097-
dc.citation.endPage1101-
dc.subject.keywordAuthorFED-
dc.subject.keywordAuthorGlass-to-glass bonding-
dc.subject.keywordAuthoramorphous silicon film-
dc.subject.keywordAuthorsi-O bond-
dc.subject.keywordAuthor유리-유리 접합-
dc.subject.keywordAuthor비정질 실리콘 박막-
dc.subject.keywordAuthor실리콘-산소 결합-
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