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dc.contributor.authorChoi, WK-
dc.contributor.authorSong, JH-
dc.contributor.authorKim, KH-
dc.contributor.authorLee, CM-
dc.contributor.authorChoi, SC-
dc.contributor.authorSong, JH-
dc.contributor.authorJung, HJ-
dc.date.accessioned2024-01-21T15:02:09Z-
dc.date.available2024-01-21T15:02:09Z-
dc.date.created2021-09-05-
dc.date.issued1999-10-08-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/141881-
dc.description.abstractCu thin film was deposited by a self-ion assisted beam source (SIAB) and the assessment of the Cu films was given. Some characteristics of the source and the experimental procedure are described at various conditions such as total power, ionization efficiency, and ion current vs. deposition rate. The dependence of crystalline structure, impurity concentration, and resistivity of the Cu films deposited by SIAB on acceleration voltage are discussed. (C) 1999 Elsevier Science S.A. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectPARTIALLY-IONIZED BEAM-
dc.subjectDEPOSITION-
dc.subjectFILMS-
dc.titleA self-ion assisted beam (SIAB) source based upon unvala electron beam scheme-
dc.typeArticle-
dc.identifier.doi10.1016/S0040-6090(99)00412-5-
dc.description.journalClass1-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.354, no.1-2, pp.29 - 33-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume354-
dc.citation.number1-2-
dc.citation.startPage29-
dc.citation.endPage33-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000083571500007-
dc.identifier.scopusid2-s2.0-0033366038-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle-
dc.subject.keywordPlusPARTIALLY-IONIZED BEAM-
dc.subject.keywordPlusDEPOSITION-
dc.subject.keywordPlusFILMS-
dc.subject.keywordAuthorCu thin film-
dc.subject.keywordAuthorself-ion assisted beam-
dc.subject.keywordAuthorionization efficiency-
dc.subject.keywordAuthorresistivity-
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