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dc.contributor.author주병권-
dc.contributor.author오명환-
dc.date.accessioned2024-01-21T16:06:20Z-
dc.date.available2024-01-21T16:06:20Z-
dc.date.created2022-01-10-
dc.date.issued1999-01-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/142515-
dc.titleMEMS/FED packaging 기술 동향 (I) : 기판 접합 공정 중심으로-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitation전자부품 = The Electronic Parts & Components Monthly, pp.66 - 79-
dc.citation.title전자부품 = The Electronic Parts & Components Monthly-
dc.citation.startPage66-
dc.citation.endPage79-
dc.subject.keywordAuthorMEMS-
dc.subject.keywordAuthorFED-
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