DSpace at KIST: Effects of post-pattern annealing on electromigration in Al-2Cu interconnects

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DC Field	Value	Language
dc.contributor.author	한준현	-
dc.contributor.author	신명철	-
dc.date.accessioned	2024-01-21T18:45:35Z	-
dc.date.available	2024-01-21T18:45:35Z	-
dc.date.created	2022-01-10	-
dc.date.issued	1997-01	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/144059	-
dc.title	Effects of post-pattern annealing on electromigration in Al-2Cu interconnects	-
dc.title.alternative	Al-2Cu interconnects에서 electromigration에 미치는 post-pattern 어닐링의 영향	-
dc.type	Article	-
dc.description.journalClass	3	-
dc.identifier.bibliographicCitation	대한금속학회지 = J. of the Korean inst. of met. & mater., v.35, no.11, pp.1555 - 1560	-
dc.citation.title	대한금속학회지 = J. of the Korean inst. of met. & mater.	-
dc.citation.volume	35	-
dc.citation.number	11	-
dc.citation.startPage	1555	-
dc.citation.endPage	1560	-
dc.subject.keywordAuthor	electromigration	-
dc.subject.keywordAuthor	interconnect	-
dc.subject.keywordAuthor	annealing	-

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