Ar+ ion irradiation in oxygen environment for improving wettability of polymethylmethacrylate
- Authors
- Koh, SK; Choi, WK; Cho, JS; Song, SK; Kim, YM; Jung, HJ
- Issue Date
- 1996-11
- Publisher
- MATERIALS RESEARCH SOCIETY
- Citation
- JOURNAL OF MATERIALS RESEARCH, v.11, no.11, pp.2933 - 2939
- Abstract
- Ion irradiation with various oxygen flow rates has been carried out to improve the wettability of polymethylmethacrylate (PMMA) to water and to enhance the adhesion between Al and the polymer. Ar+ ion and oxygen ion were irradiated on the polymer, and amounts of ions were changed from 5 x 10(14) Ar+/cm(2) to 5 x 10(16) Ar+/cm(2) by a broad ion beam source. Oxygen gas from 0 ml/min to 7 ml/min was flowed near the polymer surface during the ion irradiation, and the energy of ions was changed from 500 eV to 1500 eV. The wetting angle was reduced from 68 degrees to 49 degrees with the Ar+ ion irradiation only at 1 keV energy, to 43 degrees with the oxygen ion irradiation, and dropped to 8 degrees with Ar+ ion irradiation with flowing 4 ml/min oxygen gas near the polymer surface. Changes of wetting angle with oxygen gas and Ar+ ion irradiation were explained by a two-step chemical reaction among polymer matrix, energetic ions, and oxygen gas. The effects of Ar+ ion and oxygen ion irradiation were explained by considering formation of hydrophilic groups due to a reaction between irradiated polymer chain by energetic ion irradiation and blown oxygen gas, and enhanced adhesion between Al and PMMA was explained by the formation of electron acceptor groups in polymer and electron donors in metal, and by the chemical reaction in the interface between irradiated polymer surface and deposited metal.
- Keywords
- THIN-FILM ADHESION; BEAM-ENHANCED ADHESION; SURFACE MODIFICATION; POLYIMIDE; POLYPROPYLENE; THIN-FILM ADHESION; BEAM-ENHANCED ADHESION; SURFACE MODIFICATION; POLYIMIDE; POLYPROPYLENE
- ISSN
- 0884-2914
- URI
- https://pubs.kist.re.kr/handle/201004/144258
- DOI
- 10.1557/JMR.1996.0371
- Appears in Collections:
- KIST Article > Others
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