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dc.contributor.author고석근-
dc.contributor.author최원국-
dc.contributor.author송석균-
dc.contributor.authorKook D. Pae-
dc.contributor.author정형진-
dc.date.accessioned2024-01-21T21:45:15Z-
dc.date.available2024-01-21T21:45:15Z-
dc.date.created2022-01-10-
dc.date.issued1994-01-
dc.identifier.issn1225-8822-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/145708-
dc.languageEnglish-
dc.publisher한국진공학회-
dc.titleThermally-induced atomic mixing at the interface of Cu and polyimide-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국진공학회지, v.3, no.3, pp.316 - 321-
dc.citation.title한국진공학회지-
dc.citation.volume3-
dc.citation.number3-
dc.citation.startPage316-
dc.citation.endPage321-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassother-
dc.subject.keywordAuthorcopper-
dc.subject.keywordAuthorpolyimide-
dc.subject.keywordAuthorinterface-
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