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dc.contributor.author김용혁-
dc.contributor.author이성래-
dc.date.accessioned2024-01-22T00:46:10Z-
dc.date.available2024-01-22T00:46:10Z-
dc.date.created2022-01-10-
dc.date.issued1989-03-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/147371-
dc.titleA study of intermetallic compound growth in the Sn/Cu and Sn/Ni couples (I) : intermetallic compound formation and growth kinetics.-
dc.title.alternativeSn/Cu 및 Sn/Ni 계면에서 금속간화합물의 형성 및 성장에 관한 연구 (I) :-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitation금속표면처리 = Journal of the metal finishing society of Korea, v.v. 22, no.no. 1, pp.3 - 9-
dc.citation.title금속표면처리 = Journal of the metal finishing society of Korea-
dc.citation.volumev. 22-
dc.citation.numberno. 1-
dc.citation.startPage3-
dc.citation.endPage9-
dc.subject.keywordAuthorintermetallic compound-
dc.subject.keywordAuthorSn/Cu-
dc.subject.keywordAuthorSn/Ni-
dc.subject.keywordAuthorCu//6Sn//5-
dc.subject.keywordAuthorNi//3Sn//4-
dc.subject.keywordAuthorgrowth kinetics-
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