Effects of multidimensional-assembly-structures of CNTs on the evolution of various properties of resultant products therefrom

Authors
Cho, Young ShikPark, Ji YongLee, Jae WonKim, Jeong SeobKim, Hyun WooPark, Young JoonYang, Seung JaePark, Chong Rae
Issue Date
2024-08
Publisher
Elsevier BV
Citation
Materials Chemistry and Physics, v.322
Abstract
The realization of the exceptional intrinsic properties of carbon nanotubes (CNTs) remains a significant challenge in the field of CNT yarns and films. A fundamental lack of understanding regarding how the bundle dimensions determines the properties and how to control these bundles has resulted in insufficient performances of CNTbased components. Recognizing the absence of systematic guidelines for preparing high-performance CNT yarns or films, our focus has been on investigating the driving forces behind multidimensional CNT bundles to uncover structure-property correlations based on the dimension. We have revisited the state-of-the-art progress in engineering methods for microstructure to provide insights on achieving the desired microstructure. The interdependencies between electrical and mechanical properties, as well as the agglomeration and alignment behavior of both nanoscale and microscale bundles, emphasize the importance of selecting between dried-state engineering and swollen-state engineering of bundles within CNT yarns or films depending on their dimensions. On the basis of consideration and discussions on the advanced technologies and theoretical approaches, we have proposed possible routes to further enhance the properties of CNT yarns and films.
Keywords
CARBON-NANOTUBE FIBERS; ELECTRICAL-CONDUCTIVITY; LOAD-TRANSFER; HIERARCHICAL STRUCTURE; RHEOLOGICAL PROPERTIES; MECHANICAL-PROPERTIES; POLYMER COMPOSITES; STRENGTH; FILMS; SPUN; Carbon nanotubes; Yarns; Films; Bundles engineering; Tensile strength; Electrical conductivity
ISSN
0254-0584
URI
https://pubs.kist.re.kr/handle/201004/150891
DOI
10.1016/j.matchemphys.2024.129528
Appears in Collections:
KIST Article > 2024
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