Thermally conductive and self-healable phase change nanocomposites from phenylnaphthalene Monomer, and programmed heat transfer materials derived therefrom for advanced thermal management systems

Authors
Koo, JahyeonHyeong, JaeseokKim, SangheeRim, MinwooSung, ChanghyeonSeo, SeongminKim, Song-EunKim, SeunghunKim, Dae-YoonJeong, Kwang-Un
Issue Date
2025-04
Publisher
Elsevier BV
Citation
Chemical Engineering Journal, v.510
Abstract
Phase change materials (PCMs) based on molecular engineering approaches recently stand out in view of largescale production, mechanical strength, long-term stability, and practical applicability. Beyond, the further endeavors to add some functionalities such as self-healing and high thermal conductivity is considered to have a significant impact. In this regard, a thermally conductive and self-healable phase change polymer network (TPN) and its hexagonal boron nitride (h-BN) composites (TPN-BNx) are newly proposed. The fabricated TPN-BNx guarantees outstanding mechanical strength and modulus, and its phase change between solid and rubbery states occurs at a temperature range (30-82 degrees C) with the enthalpy change (43.6-20.5 J g- 1). The phenyl- naphthalene (PNP) crystallites in TPN lead to its high thermal conductivity (kappa = 0.51W m- 1 K-1). The synergetic phonon transfer of PNP crystallites and h-BN particles results in a significant thermal conductivity enhancement up to 3.29W m- 1 K-1. Self-healability and recyclability of TPN and TPN-BNx by dynamic bond exchange between thiol and disulfide groups not only accord with a global demand for being eco-friendly, but also create the programmed heat transfer materials with specific heat transfer behaviors. This new approach provides a significant insight in the development of advanced thermal management systems.
Keywords
NITRIDE COMPOSITES; PERFORMANCE; THIOL; Phase change material; Thermally conductive composite; Self-healing; Dynamic bond exchange; Thiol-acrylate Michael addition
ISSN
1385-8947
URI
https://pubs.kist.re.kr/handle/201004/152246
DOI
10.1016/j.cej.2025.161680
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KIST Article > Others
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