이종 접합 반도체 기판, 그의 제조방법 및 그를 이용한 전자소자

Author
백승협영서광한재훈이병철윤정호송현철김성근강종윤최지원김진상
Assignee
한국과학기술연구원
Regitration Date
2026-05-05
Registration No.
12,622,173
Application Date
2022-06-13
Application No.
17/839,207
Country
US
URI
https://pubs.kist.re.kr/handle/201004/154758
Appears in Collections:
KIST Patent > 2022
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