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Results 1-10 of 31 (Search time: 0.003 seconds).
Item hits:
Issue Date
Title
Author(s)
-
Packaging of the MEMS devices using thin silicon wafer
박윤권
;
김용국
;
Kim Hun
;
LEE YUN HI
;
김철주
;
Ju Byeong Kwon
-
3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .
김용국
;
박윤진
;
김철주
;
Ju Byeong Kwon
-
A novel wafer level packaging of the RF-MEMS devices with low loss
박윤권
;
이덕중
;
박흥우
;
송인상
;
김정우
;
SONG CI MOO
;
LEE YUN HI
;
김철주
;
Ju Byeong Kwon
-
Wafer level sealing technology of MEMS devices using B-stage epoxy
박흥우
;
박윤권
;
이덕중
;
김철주
;
PARK JEONG HO
;
서용교
;
김정우
;
SONG CI MOO
;
OH MYUNG HWAN
;
Ju Byeong Kwon
-
Packaging of the RF-MEMS switch
박흥우
;
이덕중
;
박윤권
;
김철주
;
PARK JEONG HO
;
서용교
;
김정우
;
SONG CI MOO
;
OH MYUNG HWAN
;
Ju Byeong Kwon
-
Study on the batch fabrication of silicon diaphragms
하병주
;
Ju Byeong Kwon
;
차균현
;
OH MYUNG HWAN
;
김철주
-
(Undefined)
Ju Byeong Kwon
;
OH MYUNG HWAN
;
하병주
;
차균현
;
김철주
-
Fabrication of piezoresistive pressure sensor and its application to digital pressure guage
하병주
;
Ju Byeong Kwon
;
박선우
;
차균현
;
OH MYUNG HWAN
;
김철주
-
Fabrication of Si tips for field emission devices
Ju Byeong Kwon
;
OH MYUNG HWAN
;
박흥우
;
하병주
;
박재홍
;
김철주
-
The backside gettering of OSF using CVD-BN
Ju Byeong Kwon
;
홍순관
;
Rhee Jae Seong
;
김철주
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-Author
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OH MYUNG HWAN
15
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12
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8
Jung Jae Hoon
8
SUH SANG HEE
7
LEE YUN HI
7
PARK JEONG HO
7
고창기
5
Oh Young-Jei
5
하병주
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-Subject
8
MEMS
3
FED
2
FEA
2
flip-chip
1
bump
1
cantilver
1
direct bonding
1
FBAR
1
field emission
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