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A novel wafer level packaging of the RF-MEMS devices with low loss

Other Titles

RF-MEMS 소자의 저 손실을 위한 새로운 웨이퍼 레벨 패키징

Authors

박윤권; 이덕중; 박흥우; 송인상; 김정우; SONG CI MOO; LEE YUN HI; 김철주; Ju Byeong Kwon

Citation

4 회 한국 MEMS 학술대회, pp.70 - 75

Keywords

flip-chip; wafer level package; RF-MEMS; bump

URI

https://pubs.kist.re.kr/handle/201004/107028

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KIST Conference Paper > Others

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