Improving Electromagnetic Interference Shielding Performance of Conductive Polymer Composite through Segregated Structure

Abstract

In this study, a conductive polymer composite (CPC) with segregated structure was fabricated, resulting in a low electrical percolation threshold in electrical conductivity and improved electromagnetic shielding performance compared to a composite in which the conductive filler is uniformly dispersed within the polymer matrix. The polymer matrix used was the widely recognized engineering plastic, polyamide 6 (PA6), and the conductive filler employed was graphene nanoplatelets (GNP) at various weight percentages (0.3/0.7/3/5 wt%). To create a segregated structure, core-shell structured GNP/PA6 particles were manufactured using mechano-fusion process, and subsequently, the specimens were fabricated via hot pressing. Electrical conductivity and permittivity increased, resulting in about two-fold increase in EMI shielding performance (76 to 240 %) compared to homogeneously dispersed CPC.