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dc.contributor.authorShim, Joonsup-
dc.contributor.authorLim, Jinha-
dc.contributor.authorGeum, Dae-Myeong-
dc.contributor.authorYou, Jong-Bum-
dc.contributor.authorYoon, Hyeonho-
dc.contributor.authorKim, Joon Pyo-
dc.contributor.authorBaek, Woo Jin-
dc.contributor.authorHan, Jae-Hoon-
dc.contributor.authorKim, SangHyeon-
dc.date.accessioned2024-01-12T03:43:21Z-
dc.date.available2024-01-12T03:43:21Z-
dc.date.created2022-11-16-
dc.date.issued2022-
dc.identifier.issn0277-786X-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/77263-
dc.description.abstractWe experimentally demonstrate the free-carrier absorption (FCA)-assisted photodetection using a waveguide-integrated bolometer on the silicon-on-insulator (SOI) platform at the near-infrared range (1520-1620 nm). A heavily-doped silicon (n(+) Si) plays a role as an efficient light absorption medium, which exploits the mechanism of FCA in Si. For the thermal-to-electrical conversion, a bolometric material of TiOx/Ti/TiOx tri-layer film is integrated onto the n(+) Si. It offers a sensitivity of -26.75 %/mW with a highly flat spectral response. In addition, a clear on/off bolometric response with the 1 kHz-modulated optical signal was obtained with the rise and fall times of 24.2 mu s and 29.2 mu s, respectively, which is enough for diverse sensing applications.-
dc.languageEnglish-
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING-
dc.titleFree-carrier absorption-assisted photodetection using a waveguide-integrated bolometer with flat spectral response for integrated optical sensors-
dc.typeConference-
dc.identifier.doi10.1117/12.2632304-
dc.description.journalClass1-
dc.identifier.bibliographicCitationConference on Infrared Sensors, Devices, and Applications XII-
dc.citation.titleConference on Infrared Sensors, Devices, and Applications XII-
dc.citation.conferencePlaceUS-
dc.citation.conferencePlaceSan Diego, CA-
dc.citation.conferenceDate2022-08-24-
dc.relation.isPartOfINFRARED SENSORS, DEVICES, AND APPLICATIONS XII-
dc.identifier.wosid000878106800010-
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KIST Conference Paper > 2022
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