Heat transfer analysis of variable stiffness endoscope utilizing thermoplastic and thermoelectric device inside large intestine

Abstract

Variable stiffness mechanism is required for the large intestine endoscopy to prevent medical accident and to reduce procedure time. The variable stiffness endoscope can provide two state that one is a stiff state for physical manipulation of tumor and the other is a soften state for navigation inside a serpentine path of large intestine. This paper analyzes the heat transfer effect of a variable stiffness mechanism utilizing a thermoplastic and thermoelectric device inside the large intestine by finite element method simulation. The result shows that the heat generated by thermoelectric devices of variable stiffness mechanism is higher than body temperature, the temperature at a contact point between the mechanism and large intestine does not rise rapidly due to the heat dissipation through the body.