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dc.contributor.author안광덕-
dc.contributor.author강종희-
dc.contributor.author한동근-
dc.date.accessioned2024-01-12T04:36:04Z-
dc.date.available2024-01-12T04:36:04Z-
dc.date.issued2005-11-07-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/78219-
dc.title반도체 미세회로 형성을 위한 반사 방지막용 열가교결합성 유기 고분자, 이를 이용한 반사 방지막 조성물 및 그 제조방법-
dc.typePatent-
dc.date.registration2005-11-07-
dc.date.application2003-09-22-
dc.identifier.patentRegistrationNumber0528454-
dc.identifier.patentApplicationNumber2003-0065675-
dc.publisher.countryKO-
dc.type.iprs특허-
dc.contributor.assignee한국과학기술연구원-
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