DSpace at KISTKIST Conference Paper2018

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dc.contributor.authorLee, Myung Jae-
dc.date.accessioned2024-01-12T05:42:55Z-
dc.date.available2024-01-12T05:42:55Z-
dc.date.created2022-01-14-
dc.date.issued2018-09-10-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/79066-
dc.publisherIIAE-
dc.titleChip on Chip Bonding Technology for Fine Pitch Connection With Al-Si/TiN Bumps-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIIAE International Conference on Intelligent Systems and Image Processing-
dc.citation.titleIIAE International Conference on Intelligent Systems and Image Processing-
dc.citation.conferencePlaceJA-
dc.relation.isPartOfIIAE-
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KIST Conference Paper > 2018
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