Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Myung Jae | - |
| dc.date.accessioned | 2024-01-12T06:15:13Z | - |
| dc.date.available | 2024-01-12T06:15:13Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 2016-09-13 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/79579 | - |
| dc.publisher | Japan Society Applied Physics | - |
| dc.title | Evaluation of Resister and Diode Characteristics for Chip on Chip Bonding Using "AlSi/TiN" Bumps and Concave Shape Electrode With ACP | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Japan Society of Applied Physics Autumn Meeting | - |
| dc.citation.title | Japan Society of Applied Physics Autumn Meeting | - |
| dc.citation.conferencePlace | JA | - |
| dc.relation.isPartOf | Japan Society Applied Physics | - |
- Appears in Collections:
- KIST Conference Paper > 2016
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