Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Myung Jae | - |
| dc.date.accessioned | 2024-01-12T06:16:24Z | - |
| dc.date.available | 2024-01-12T06:16:24Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 2016-01-23 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/79634 | - |
| dc.publisher | Technical College Symposium | - |
| dc.title | Evaluation of the Three-Dimensional Mounting of the Integrated Circuit Using ACP | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Technical College Symposium | - |
| dc.citation.title | Technical College Symposium | - |
| dc.citation.conferencePlace | JA | - |
| dc.relation.isPartOf | Technical College Symposium | - |
- Appears in Collections:
- KIST Conference Paper > 2016
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