DSpace at KISTKIST Conference Paper2006

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dc.contributor.authorHong, K.T.-
dc.contributor.authorJi, Y.S.-
dc.contributor.authorChung, S.J.-
dc.contributor.authorOk, M.-R.-
dc.contributor.authorJi, Y.H.-
dc.contributor.authorLee, K.S.-
dc.date.accessioned2024-01-12T07:56:33Z-
dc.date.available2024-01-12T07:56:33Z-
dc.date.created2022-03-07-
dc.date.issued2006-07-
dc.identifier.issn0255-5476-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/81598-
dc.description.abstractThe crystallization behavior of Cu and Zr-base Bulk Metallic Glass were investigated using the electrical resistivity measurements in isothermal annealing. Electrical resistivity evolutions exhibited one or two stage of resistivity reduction according to additional elements respectively. In order to analyze the electrical resistivity reduction, micro structure evolutions were analyzed using DSC, XRD, and TEM.-
dc.languageEnglish-
dc.publisherTrans Tech Publications Ltd-
dc.titleAnalysis on the phase transition behavior of bulk metallic glass by electrical resistivity measurement-
dc.typeConference-
dc.identifier.doi10.4028/0-87849-428-6.2065-
dc.description.journalClass1-
dc.identifier.bibliographicCitation5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.2065 - 2070-
dc.citation.title5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006-
dc.citation.startPage2065-
dc.citation.endPage2070-
dc.citation.conferencePlaceUS-
dc.citation.conferencePlaceVancouver-
dc.citation.conferenceDate2006-07-04-
dc.relation.isPartOfMaterials Science Forum-
dc.identifier.scopusid2-s2.0-38349042195-
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KIST Conference Paper > 2006
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