반도체 기판의 정전 열 접합방법

Author
주병권오명환최우범
Assignee
한국과학기술연구원
Regitration Date
2001-03-26
Registration No.
292682
Application Date
1997-09-03
Application No.
97-45605
Country
KO
URI
https://pubs.kist.re.kr/handle/201004/82216
Appears in Collections:
KIST Patent > Others
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