Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김동준 | - |
dc.contributor.author | 김용태 | - |
dc.date.accessioned | 2024-01-12T08:36:38Z | - |
dc.date.available | 2024-01-12T08:36:38Z | - |
dc.date.issued | 2000-01-08 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/82254 | - |
dc.title | TaSiNx확산 방지막의 제조방법과 그를 이용한 반도체 소자의 접촉접합및 다층금속 배선 | - |
dc.type | Patent | - |
dc.date.registration | 2000-01-08 | - |
dc.date.application | 1997-11-04 | - |
dc.identifier.patentRegistrationNumber | 250954 | - |
dc.identifier.patentApplicationNumber | 97-57884 | - |
dc.publisher.country | KO | - |
dc.type.iprs | 특허 | - |
dc.contributor.assignee | 한국과학기술연구원 | - |
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