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TaSiNx확산　방지막의　제조방법과 그를　이용한　반도체　소자의　접촉접합및　다층금속　배선

Author

김동준; 김용태

Assignee

한국과학기술연구원

Regitration Date

2000-01-08

Registration No.

250954

Application Date

1997-11-04

Application No.

97-57884

Country

KO

URI

https://pubs.kist.re.kr/handle/201004/82254

Appears in Collections:

KIST Patent > Others

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