DSpace at KISTKIST Patent2002

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dc.contributor.author홍성안-
dc.contributor.author한종희-
dc.contributor.author류보현-
dc.contributor.author하흥용-
dc.contributor.author오인환-
dc.contributor.author임태훈-
dc.contributor.author남석우-
dc.contributor.author윤성필-
dc.date.accessioned2024-01-12T10:33:54Z-
dc.date.available2024-01-12T10:33:54Z-
dc.date.issued2004-05-04-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/84614-
dc.title팩　시멘테이션　방법을　이용한　엠씨에프씨용　분리판의　금속부식　방지막　코팅　방법　및　시스템-
dc.typePatent-
dc.date.registration2004-05-04-
dc.date.application2002-01-23-
dc.identifier.patentRegistrationNumber0431696-
dc.identifier.patentApplicationNumber2002-0003925-
dc.publisher.countryKO-
dc.type.iprs특허-
dc.contributor.assignee한국과학기술연구원-
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KIST Patent > 2002
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