팩 시멘테이션 방법을 이용한 엠씨에프씨용 분리판의 금속부식 방지막 코팅 방법 및 시스템

Author
홍성안한종희류보현하흥용오인환임태훈남석우윤성필
Assignee
한국과학기술연구원
Regitration Date
2004-05-04
Registration No.
0431696
Application Date
2002-01-23
Application No.
2002-0003925
Country
KO
URI
https://pubs.kist.re.kr/handle/201004/84614
Appears in Collections:
KIST Patent > 2002
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