Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jeong, Jeung hyun | - |
| dc.date.accessioned | 2024-01-12T11:39:22Z | - |
| dc.date.available | 2024-01-12T11:39:22Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 1996-01-01 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/85942 | - |
| dc.title | 반도체 칩 재료의 미세파괴기구 해석 및 신뢰성 평가 연구 | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 대한금속학회, pp.521 - 538 | - |
| dc.citation.title | 대한금속학회 | - |
| dc.citation.startPage | 521 | - |
| dc.citation.endPage | 538 | - |
| dc.relation.isPartOf | 제10회 재료강도 심포지엄 | - |
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