Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jeong, Jeung hyun | - |
| dc.date.accessioned | 2024-01-12T11:39:29Z | - |
| dc.date.available | 2024-01-12T11:39:29Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 1996-01-01 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/85947 | - |
| dc.title | Quantitative evaluation of interface adhesion in DLC film/metal system through the analysis | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.relation.isPartOf | The 2nd Korea-Japan Symposium on Plasma and Thin Film Technology | - |
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