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dc.contributor.authorKim, Yong Tae-
dc.date.accessioned2024-01-12T11:41:18Z-
dc.date.available2024-01-12T11:41:18Z-
dc.date.created2022-01-14-
dc.date.issued1994-07-01-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/86027-
dc.titleThermal stability of plasma deposited tungsten nitride thin films for VLSI devices-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation1-st China-Korea Sym.on Thin Film Materials, pp.0-
dc.citation.title1-st China-Korea Sym.on Thin Film Materials-
dc.citation.startPage0-
dc.citation.endPage0-
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